METALLURGICAL GRADE TANTALUM – high degree of purity and extremely fine

Tantalum's importance and relevance in industrial manufacturing are due to its unique properties, which make it a preferred material for countless high-performance applications. For example, tantalum has a very high density and exhibits excellent thermal and electrical conductivity. The melting point of 3,017 °C is the fourth-highest of all metals.
Tantalum Metal Powder
Due to these and other unique properties, tantalum is highly suitable for numerous applications in the optics and electronics industries.

H.C. Starck Tantalum and Niobium is one of the leading providers of high-quality tantalum powders for metallurgical applications. The powders are characterized by particularly fine grain sizes and an extremely high level of purity. With respect to technical functionality and cost-effectiveness, these powders meet all of our customers’ expectations. Above all, H.C. Starck Tantalum and Niobium provides consistently high quality and its tantalum products are easily available.

Leading supplier of tantalum for sputter targets

Our high quality tantalum powders for metallurgical applications are primarily used for manufacturing sputter targets, the third largest application for tantalum powder, following capacitors and superalloys. H.C. Starck Tantalum and Niobium is one of the leading suppliers of tantalum for sputter targets. These are primarily used in semiconductor applications for high-speed data processing and for storage solutions in the consumer electronics industry. Examples include logic IC components, flash memory and DRAM modules.

Sputtering is a process in which physical vapor deposition (PVD) is used to deposit a thin film onto a substrate. Due to the trend toward increasingly smaller and more powerful electronic devices, sputter targets are extremely important in the semiconductor industry. In order to maintain the signal propagation speed even in smaller transistor cells, because of its higher conductivity, copper replaced the aluminum that was previously used for the circuit paths in the chips. However, copper has a tendency to spread out over the silicon, which means that a boundary layer consisting of a material containing titanium or tantalum nitride must be deposited in between. Sputtering creates this layer. H.C. Starck Tantalum and Niobium produces high-purity, extremely fine tantalum for the required metallurgical applications.

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